15015-0833

Molex
538-15015-0833
15015-0833

Fabricante:

Descripción:
Cables de puente FFC / FPC Premo-Flex 0.30 Jmpr Lgt 8.00 TypeA 33Ck

Ciclo de vida:
Pedido especial de fábrica:
Obtenga una cotización para verificar el precio actual, plazo de entrega y requisitos para realizar pedidos del fabricante.
Hoja de datos:

En existencias: 951

Existencias:
951 Se puede enviar inmediatamente
Las cantidades superiores a 951 estarán sujetas a requisitos mínimos de pedido.
Mínimo: 1   Múltiples: 1
Precio unitario:
$-.--
Precio ext.:
$-.--
Est. Tarifa:

Precio (USD)

Cantidad Precio unitario
Precio ext.
$2.28 $2.28
$2.22 $22.20

Atributo del producto Valor de atributo Seleccionar atributo
Molex
Categoría de producto: Cables de puente FFC / FPC
RoHS:  
33 Conductor
0.3 mm
203 mm
Same Side Contacts
200 mA
50 VAC/DC
15015
Bulk
Marca: Molex
Material del contacto: Copper
Revestimiento del contacto: Gold
País de ensamblaje: Not Available
País de difusión: Not Available
País de origen: CN
Material de revestimiento: Polyimide (PI)
Temperatura de trabajo máxima: + 105 C
Temperatura de trabajo mínima: - 40 C
Tipo de producto: FFC / FPC Jumper Cables
Cantidad de empaque de fábrica: 1000
Subcategoría: Cable
Nombre comercial: Premo-Flex
Alias de las piezas n.º: 0150150833 150150833
Peso de la unidad: 1 g
Productos encontrados:
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Atributos seleccionados: 0

Hoja de datos

CAHTS:
8544490019
USHTS:
8544492000
TARIC:
8544499190
MXHTS:
85442099
ECCN:
EAR99

Premo-Flex FFC Jumpers

Molex Premo-Flex Flat Flexible Cable (FFC) Jumpers offer an extensive range of standard products that deliver flexibility and performance with various pitch sizes, cable lengths, plating options, and thicknesses. This range of options makes these cables ideal for use in virtually any industry. Combined with Molex Easy-On Connectors, these Premo-Flex FFC cables provide a flat, flexible connectivity solution.

Premo-Flex™ Etched-Copper Polyimide Cable Jumpers

Molex Premo-Flex™ Etched-Copper Polyimide Cable Jumpers feature a polyimide substrate and etched-copper technology that achieves the tight tolerances required for reliable connections with 0.30mm pitch microminiature FPC connectors. These off-the-shelf, ultra-flexible jumpers terminate to Zero Insertion Force (ZIF) FFC connectors, enabling designers to use the same PCB pattern on adjoining parallel PCBs. Using the Premo-Flex™ 0.30mm Pitch Etched-Copper Polyimide Cable Jumpers, designers can maximize board space and design flexibility in compact applications. Premo-Flex™ jumpers are now available with additional circuit and cable dimensions for various design options. 

Premo-Flex 0.30mm Etched-Copper Polyimide Jumpers

Molex Premo-Flex Etched-Copper Polyimide Cable Jumpers offer a 0.2A current rating, 50VAC voltage, and -40°C to +105°C temperature range. These jumpers feature etched-copper technology to achieve the tight tolerances required for reliable connections with 0.30mm pitch microminiature FPC connectors that standard copper wire FFC jumpers cannot. These off-the-shelf, ultra-flexible jumpers terminate to Zero Insertion Force (ZIF) FFC connectors, and enable designers to use the same PCB pattern on adjoining parallel PCBs. Using the Molex Premo-Flex 0.30mm Pitch Etched-Copper Polyimide Cable Jumpers, designers can maximize board space and design flexibility in compact applications such as small electronic devices, digital cameras and handheld medical equipment. 

FFC/FPC Connectors

Molex Flexible Flat Cable / Flexible Printed Circuit (FFC/FPC) Connectors feature a variety of product line-ups that combine signal reliability, compactness, a wide circuit size range, and cable style. Molex FFC/FPC connectors have a one to 136 circuit design and a 0.2mm to 2.54mm pitch range, depending on the model.

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.

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