171224-8014

Molex
538-171224-8014
171224-8014

Fabricante:

Descripción:
Conectores I/O zSFP+ Stacked 2X8 W/Metal w/outer LP

Modelo ECAD:
Descargue Library Loader gratis para convertir este archivo para su herramienta ECAD. Conozca más sobre el modelo ECAD.

Disponibilidad

Existencias:
No en existencias
Plazo de entrega de fábrica:
Mínimo: 64   Múltiples: 16
Precio unitario:
$-.--
Precio ext.:
$-.--
Est. Tarifa:

Precio (USD)

Cantidad Precio unitario
Precio ext.
$111.98 $7,166.72
$105.80 $11,849.60

Atributo del producto Valor de atributo Seleccionar atributo
Molex
Categoría de producto: Conectores I/O
RoHS:  
171224
Marca: Molex
País de ensamblaje: Not Available
País de difusión: Not Available
País de origen: ID
Tipo de producto: I/O Connectors
Cantidad de empaque de fábrica: 1
Subcategoría: I/O Connectors
Productos encontrados:
Para mostrar productos similares, seleccione al menos una casilla de verificación
Seleccione al menos una de las casillas de verificación anteriores para mostrar productos similares en esta categoría.
Atributos seleccionados: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zSFP+ Interconnect Solution

Molex zSFP+™ Interconnect Solution delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications. The innovative design provides excellent thermal management without adding unnecessary materials or costs. The zSFP+ Interconnect Solution features a stacked design that delivers maximum thermal efficiency while providing excellent signal integrity and Electromagnetic Interference (EMI) protection. Both an enhanced airflow version for applications that require light pipes and a thru-flow design which opens up the midsection to take advantage of front-to-back airflow are available. This design allows heat to be dissipated without the need for heat sink components or other complex and costly materials. The Molex zSFP+ is ideal for applications requiring 25Gbps data rates for next-generation Ethernet and Fibre Channel applications. The system provides a drop-in replacement for existing zSFP designs (re-routing of thru-flow design may be necessary if light pipes are in the midesction).