DA-T268-101E-TR

Ohmite
588-DA-T268-101E-TR
DA-T268-101E-TR

Fabricante:

Descripción:
Cuerpo de Refrigeración HEATSINK FOR TO-268 BLK ANODIZED

Hoja de datos:
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En existencias: 3,101

Existencias:
3,101
Se puede enviar inmediatamente
En pedido:
996
Plazo de entrega de fábrica:
28
Semanas Tiempo estimado de producción de fábrica para cantidades superiores a las que se muestran.
Mínimo: 1   Múltiples: 1
Precio unitario:
$-.--
Precio ext.:
$-.--
Est. Tarifa:

Precio (USD)

Cantidad Precio unitario
Precio ext.
$3.38 $3.38
$3.00 $30.00
$2.76 $69.00
$2.72 $272.00
Envase tipo carrete completo (pedir en múltiplos de 250)
$2.71 $677.50

Atributo del producto Valor de atributo Seleccionar atributo
Ohmite
Categoría de producto: Cuerpo de Refrigeración
RoHS:  
Heat Sinks
D3Pak (TO-268)
SMD/SMT
Aluminum
Extruded Axial Fin
31 mm
12.7 mm
10.2 mm
Marca: Ohmite
Color: Black
País de ensamblaje: Not Available
País de difusión: Not Available
País de origen: CN
Empaquetado: Reel
Empaquetado: Cut Tape
Tipo de producto: Heat Sinks
Serie: D
Cantidad de empaque de fábrica: 250
Subcategoría: Heat Sinks
Tipo: Component
Peso de la unidad: 4.300 g
Productos encontrados:
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Atributos seleccionados: 0

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Application Notes

PCN

CNHTS:
8548000090
USHTS:
8541900080
TARIC:
8517700000
ECCN:
EAR99

D Series Heatsinks

Ohmite D Series Heatsinks provide an innovative solution for SMT compatible semiconductors and resistors. The heatsinks offer a low cost, large surface area, and a small footprint that can dissipate more heat. The unique patent-pending design combines tin-plated, solderable rods with an aluminum extruded heat sink body. These rods (or “rollers”) are mated mechanically to the heatsink by forging to reduce the thermal resistance between the heatsink body and the solderable feet. Specifically designed for use with the increasingly popular TO-252, TO-263, and TO-268 packages, the D Series affords the user superior thermal performance over the more common stamped aluminum heatsinks. By eliminating the staking joint typically used in stamped heatsinks, the resulting air gap and thermal “bottle-neck” is also eliminated, while the surface area for cooling is maximized with the extruded fins of the D Series body.

Ohmite Heatsinks

Ohmite Heatsinks have been designed to take advantage of thermal transfer, reliability, and design flexibility. Ohmite's heatsink product line utilizes a patented Matrix Clip system that provides constant spring force over repeated assembly and disassembly. The elimination of mounting hardware reduces costs and enables a maximum surface area per unit design. Ohmite heatsinks are designed to secure TO-126, TO-218, TO-220, TO-247, and TO-264 packages, plus provide thermal solutions for TO-252, TO-263, and TO-268 SMD devices.
Learn More

Heat Sinkable Resistors

Ohmite offers resistors in all popular heat sinkable packages, from TO-220 through SOT-227 and in power ratings from 35W to 200W. Ohmite also supplies multiple designs in multiple constructions, including wire wound and thick film with resistance values from 0.0005MΩ to 4MΩ. Power ratings up to 2KW with proper heat sinking are also available.

Heatsinks

Ohmite Heatsinks are engineered to take advantage of thermal transfer, reliability, and design flexibility. This heat sink product line utilizes a patented clip system that provides constant spring force over repeated assembly and disassembly. The elimination of mounting hardware reduces costs and enables a maximum surface area per unit design. Ohmite Heatsinks are designed to secure TO-126, TO-218, TO-220, TO-247, and TO-264 packages as well as provide thermal solutions for TO-252, TO-263, and TO-268 SMD devices.

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