430436-501

Tark Thermal Solutions
739-430436-501
430436-501

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Descripción:
Módulos termoeléctricos Peltier Thermoelectric Cooler, Ceramic Plate, for High Current, RTV, 14.2W, 23x23x3.6mm

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No en existencias
Plazo de entrega de fábrica:
Mínimo: 1   Múltiples: 1
Precio unitario:
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Precio ext.:
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Precio (USD)

Cantidad Precio unitario
Precio ext.
$29.61 $29.61
$27.82 $139.10
$26.89 $322.68
$25.45 $610.80
$24.55 $1,473.00
$24.01 $2,593.08
$23.91 $6,025.32
1,008 Presupuesto

Atributo del producto Valor de atributo Seleccionar atributo
Tark Thermal Solutions
Categoría de producto: Módulos termoeléctricos Peltier
RoHS:  
Thermoelectric Peltier Modules
Ceramic Plate
14.2 W
+ 70.5 C
3.1 A
7.8 V
23 mm
23 mm
3.6 mm
+ 80 C
Marca: Tark Thermal Solutions
País de ensamblaje: Not Available
País de difusión: Not Available
País de origen: CN
Longitud del conductor: 114.3 mm
Producto: Thermoelectric Coolers
Serie: CP
Cantidad de empaque de fábrica: 12
Subcategoría: Thermoelectric
Estilo de terminación: Wire Leads
Alias de las piezas n.º: CP10-71-06-L-RT-W4.5 CP10,71,06,L,RT,W4.5 CP10-71-06-L-RT-W4.5 CP10-71-06-L-RT
Peso de la unidad: 26.443 g
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Laird Thermal Systems is now Tark Thermal Solutions.

Please contact a Mouser Technical Sales Representative for
further information.

5-0525-3

Hoja de datos

USHTS:
8419505000
TARIC:
8419508090
ECCN:
EAR99

CP Series Ceramic Plate Thermoelectric Coolers

Tark CP (Ceramic Plate) Thermoelectric Modules feature high-performance, highly reliable TEMs in numerous heat pumping capacities, geometric shapes, geometric sizes, and input power ranges. These components are constructed using Bismuth Telluride semiconductor material and thermally conductive aluminum oxide ceramics. The CP Thermoelectric modules offer precise temperature control and reliable solid-state operation. These TEMs are designed for higher current and large heat-pumping applications. Typical applications include thermoelectric coolers for handheld cosmetic lasers, cooling for centrifuges, and peltier cooling for machine vision.

CP Thermoelectric Modules w/ Sealant - EXPANSION

Laird has expanded its CP Series to include Thermoelectric Modules with Epoxy and RT sealants. The Epoxy version features a low-density syntactic foam epoxy encapsulant with a temperature range of -55°C to 150°C and the RT version has a non-corrosive, silicone adhesive sealant with a temperature range of -60°C to 204°C. Known as 'the standard' in the thermoelectric industry, the Laird CP Series consists of high-performance and highly reliable Thermoelectric Modules (TEMs) available in numerous heat pumping capacities, geometric shapes, geometric sizes, and input power ranges. Constructed using Bismuth Telluride semiconductor material and thermally conductive aluminum oxide ceramics, the Laird Technologies CP Series Thermoelectric Modules feature precise temperature control and reliable solid state operation. Designed for higher current and large heat-pumping applications, the Laird CP Series TEMs are ideally suited for applications such as medical lasers, lab science instrumentation, clinical diagnostic systems, photonics laser systems, electronic enclosure cooling, food and beverage cooling, and chillers (liquid cooling). RoHS Compliant and environmentally friendly.

Enfriadores termoeléctricos (TEC)

Tark Thermal Solutions Thermoelectric Coolers (TECs) are solid-state heat pumps that require a heat exchanger to dissipate heat utilizing the Peltier effect. During operation, Direct Current (DC) flows through the thermoelectric cooler to create heat transfer and a temperature differential across the ceramic substrates. This process causes one of the coolers to be cold and the other side to be hot. The Thermoelectric Coolers can be used as a power generator to convert waste heat into usable output DC power. These coolers are available in 2mm x 2mm to 62mm x 62mm dimensions. The TECs are ideal for applications that require precise temperature control, high reliability, low weight, and compact geometry constraints. Typical applications include medical diagnostics, medical imaging, battery cooling, automotive, aerospace defense, and optoelectronics.

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