Nexperia LFPAK88 Trench 9 Automotive MOSFETs
Nexperia LFPAK88 Trench 9 Automotive MOSFETs provide an alternative to D2PAK by delivering an industry-leading power density in an innovative 8mm x 8mm footprint. These Nexperia MOSFETs deliver 2x higher continuous current ratings, ultimate thermal performance and reliability, and up to 60% space efficiency. Nexperia LFPAK88 Trench 9 Automotive MOSFETs are available in automotive AEC-Q101 and industrial grades.
Features
- Fully automotive qualified beyond AEC-Q101
- -55°C to +175°C rating suitable for thermally demanding environments
- LFPAK88 package
- Designed for a smaller footprint and improved power density over older wire bond packages such as D2PAK for today’s space-constrained high-power automotive applications
- Thin package and copper clip enable LFPAK88 to be highly efficient thermally
- LFPAK copper clip technology enables improvements over wire bond packages by
- Increased maximum current capability and excellent current spreading
- Improved RDS(on)
- Low source inductance
- Low thermal resistance Rth
- LFPAK Gull Wing leads
- Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages
- Visual (AOI) soldering inspection, no need for expensive x-ray equipment
- Easy solder wetting for good mechanical solder joint
- Unique 40V Trench 9 superjunction technology
- Reduced cell pitch and superjunction platform enable lower RDSon in the same footprint
- Improved SOA and avalanche capability compared to standard TrenchMOS
- Tight VGS(th) limits enable easy paralleling of MOSFETs
Applications
- 12V automotive systems
- 48V DC/DC systems on 12V secondary side
- Higher power motors, lamps and solenoid control
- Reverse polarity protection
- LED lighting
- Ultra high-performance power switching
LFPAK88 Call-Outs
Videos
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Publicado: 2020-08-21
| Actualizado: 2024-05-03